About the role
You move information efficiently between the parts of a computer, working on the memory and packaging choices that decide practical model capacity and performance. The distinction this role lives on: advertised bandwidth, sustained bandwidth, and usable model memory are three different numbers.
The work
Evaluate packaging, memory technologies, high-speed links, thermal coupling and assembly constraints. Coordinate with architecture, signal-integrity, supplier and manufacturing teams. Translate bandwidth and reliability requirements into realistic physical and commercial options.
What good looks like
In your first 90 days after program activation, deliver a package and memory trade study with cost, availability, validation and service implications.
Evidence we look for
Bring experience with advanced packaging, memory subsystems or high-speed interconnect engineering. Understand that advertised bandwidth, sustained bandwidth and usable model memory are different quantities.
What we need to see
- Advanced packaging, memory subsystems, or high-speed interconnect engineering
- You understand that advertised, sustained and usable are different quantities, and measure the ones that matter
- You reason about the whole path rather than one component
- You can work with suppliers on what is actually achievable
Nice to have
- HBM, chiplets, or 2.5D and 3D integration
- Memory controller design
- You have influenced a packaging choice with data
The exercise
Compare two memory topologies for the same workload while accounting for capacity, power, thermal limits and testability.
Where and how we work
In the office together five days a week, in any of these cities. Remote-friendly around your family, arranged one person at a time.